| ¡¡
|
SERIAL |
ITEM |
TECHNICAL
DATA |
| 1 |
Layers |
2-20 Layers |
| 2 |
Max board
size |
450x660mm
£¨18"x26"£© |
| 3 |
Min
Board Thickness |
4 layers
0.38mm 15mil |
|
6 layers
0.55mm 22mil |
|
8 layers
0.80mm 32mil |
|
10
layers 1.00mm 40mil |
| 4 |
Copper
Clad(Max.) |
6
oz(outer)/4 oz(inner) |
| 5 |
Min line
Width/space |
0.075mm
3mil |
| 6 |
Min hole size |
0.20mm
8mil |
| 7 |
PTH wall thickness |
0.025mm
1mil |
| 8 |
PTH hole dia. tolerance |
¡À0.075mm
3mil |
| 9 |
Non PTH hole dia. tolerance |
¡À0.05mm
2mil |
| 10 |
Hole position deviation |
¡À0.05mm
2mil |
| 11 |
Outline tolerance |
¡À0.10mm
4mil |
| 12 |
Min S/M Pitch |
0.075mm
3mil |
| 13 |
Twist and Bow |
¡Ü1.0% |
| 14 |
Insulation Resistance |
£¾1012¦¸ Normal |
| 15 |
Test
Voltage |
50~300V |
| 16 |
Electric strength |
£¾1.3KV/mm |
| 17 |
Current breakdown |
10A |
| 18 |
Peel strength |
1.4N/mm |
| 19 |
Soldermask abrasion |
£¾6H |
| 20 |
Thermal stress |
288¡æ
20Sec |
| 21 |
Flammability |
94V-0 |
| 22 |
Impedance
Control |
+/-10%(Differential) |
|
23 |
Blind/Buried
via |
¡Ì |
|
24 |
Surface
Finished |
ENIG,ImAg,ImSn,OSP,HASL |
|
25 |
Materials |
Getek,Rogers,Aluminum
Board, FR-4(Tg140¡ãc,Tg170¡ãc) |
|
¡¡ |
|
